Hey guys, i was wondering if it was better to have really tight timings but a lower clock speed ot visa versa... Here is my system specs...
Chipset/RAM properties
Motherboard Chipset VIA K8T800Pro, AMD Hammer
Memory Timings 3-3-3-8 (CL-RCD-RP-RAS)
Command Rate (CR) 2T
DIMM1: Kingston K1 GB PC3200 DDR SDRAM (3.0-3-3-8 @ 200 MHz) (2.5-3-3-7 @ 166 MHz) (2.0-2-2-6 @ 133 MHz)
CPU Properties
CPU Type AMD Sempron, 2000 MHz (9 x 222) 3300+
CPU Alias Winchester-128 S754
CPU Stepping DH-D0
Instruction Set x86, MMX, 3DNow!, SSE, SSE2
Min / Max CPU Multiplier 4x / 9x
L1 Code Cache 64 KB (Parity)
L1 Data Cache 64 KB (ECC)
L2 Cache 128 KB (On-Die, ECC, Full-Speed)
CPU Physical Info
Package Type 754 Pin uOPGA
Package Size 4.00 cm x 4.00 cm
Transistors 68.5 million
Process Technology 11Mi, 90 nm, CMOS, Cu, SOI
Die Size 84 mm2
Core Voltage 1.550 - 1.450 V
I/O Voltage 1.2 V + 2.5 V
Maximum Power 67.0 W
Chipset/RAM properties
Motherboard Chipset VIA K8T800Pro, AMD Hammer
Memory Timings 3-3-3-8 (CL-RCD-RP-RAS)
Command Rate (CR) 2T
DIMM1: Kingston K1 GB PC3200 DDR SDRAM (3.0-3-3-8 @ 200 MHz) (2.5-3-3-7 @ 166 MHz) (2.0-2-2-6 @ 133 MHz)
CPU Properties
CPU Type AMD Sempron, 2000 MHz (9 x 222) 3300+
CPU Alias Winchester-128 S754
CPU Stepping DH-D0
Instruction Set x86, MMX, 3DNow!, SSE, SSE2
Min / Max CPU Multiplier 4x / 9x
L1 Code Cache 64 KB (Parity)
L1 Data Cache 64 KB (ECC)
L2 Cache 128 KB (On-Die, ECC, Full-Speed)
CPU Physical Info
Package Type 754 Pin uOPGA
Package Size 4.00 cm x 4.00 cm
Transistors 68.5 million
Process Technology 11Mi, 90 nm, CMOS, Cu, SOI
Die Size 84 mm2
Core Voltage 1.550 - 1.450 V
I/O Voltage 1.2 V + 2.5 V
Maximum Power 67.0 W
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