A weird one this, I can only find the story in the magazine, not on the website, so no real source link. Hope it's not a repost.
I didn't write it all out as my hands started to hurt :)
Source: Custom PC Magazine (any good UK retailer)
I didn't write it all out as my hands started to hurt :)
Extreme cooling is apparently becoming less extreme and more mainstream every day. Intel has released a paper showing the cooling potential of integrating a TEC into the CPU package...
...a TEC was integrated into a CPU package to reduce the temperature of high heat-flux regions (hotspots) in the CPU. The small TEC sits between the CPU and it's IHS, with a layer of TIM surrounding the sides and underside of the TEC to ensure a consistent level of thermal conductivity...
...Without the TEC, the raw temperature of the hotspots reached 124.5c, but this dropped to 116.9c when the TEC was installed without power. It dropped even further to 109.6c with 3A passing through the TEC...
Researchers have concluded the successful demonstrations of the integrated TEC offers possibilities of an overhaul in the design of high power-density electronic and optoelectronic circuitry...
...a TEC was integrated into a CPU package to reduce the temperature of high heat-flux regions (hotspots) in the CPU. The small TEC sits between the CPU and it's IHS, with a layer of TIM surrounding the sides and underside of the TEC to ensure a consistent level of thermal conductivity...
...Without the TEC, the raw temperature of the hotspots reached 124.5c, but this dropped to 116.9c when the TEC was installed without power. It dropped even further to 109.6c with 3A passing through the TEC...
Researchers have concluded the successful demonstrations of the integrated TEC offers possibilities of an overhaul in the design of high power-density electronic and optoelectronic circuitry...
Comment