The only problem I see that heat is transferred from gpu heatsinks to RAM heatsink. More area definately for dissipation, but a larger contact would be more preferable here. This is because the fins touching the RAM heatsink will be conducting more heat.
I guess it really depends. If the contact point is way hotter than the rest of the duo orb's heatsink I would begin to worry. Also if the RAM heatsink is much hotter than the other RAM's heatsink would make me think about it more.
My main concern would be the RAM and it's overheating. Another point to consider is that is the RAM exerting too much force on the Orb's heatsink to cause uneven tension to it's locking mechanism? By this I mean that if that's the case it might cause the base of the Orb's heatsink to rise the millimeter and your are in danger of toasting the 3870 in full gallop.
It's a hard call.
I guess it really depends. If the contact point is way hotter than the rest of the duo orb's heatsink I would begin to worry. Also if the RAM heatsink is much hotter than the other RAM's heatsink would make me think about it more.
My main concern would be the RAM and it's overheating. Another point to consider is that is the RAM exerting too much force on the Orb's heatsink to cause uneven tension to it's locking mechanism? By this I mean that if that's the case it might cause the base of the Orb's heatsink to rise the millimeter and your are in danger of toasting the 3870 in full gallop.
It's a hard call.
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